Vapor-X Cooling
The Vapor Chamber is mounted in contact with the surface of the main chip and memory. Since the entire area transfers heat at the same rate, the Vapor-X module has been engineered to operate more efficiently than a copper heat sink at carrying away heat. Upon gaining heat, the heat source is pushed to the Vaporization Wicks to begin the heat dissipation process. Due to extreme low pressure, working fluid and pure water are easily vaporized, and transferred through the vacuum until reaching the Condensing Wick which is adjacent to the cooled surface. From here, it turns back to a liquid state whereby the liquid is then absorbed into the Transportation Wick by capillary action and moved back towards the Vaporization Wick. A recycled liquid system occurs when the heat source reheats the liquid and it becomes re-vaporized by the Vaporization Wick to restart the Vapor-X Cooling process.
V-Shape Fin Design for GPU cooling
The WAVE Fin Design reduces friction when the wind goes into the fin module resulting in a reduction of the wind cut noise.
The V-shape fin design on top of the GPU accelerates and centralizes the air flow around the GPU to dissipate heat efficiently.
Alloy Frame & Frontplate Heatsink
The Die Casted Aluminum-Magnesium Alloy Frame enveloping the sides of the PCB help to strengthen the structural stiffness of the shroud to create a strong, scratch resistant and high quality finish that elevates the aesthetic and strength of the graphics card. Overlaying the entire PCB, the die casted Frontplate Heatsink cools the VRM, Memory and Chokes resulting in superior heat dissipation for top-notch airflow and cooling performance.
Power Design
SAPPHIRE NITRO+ & PULSE AMD Radeon™ RX 7900 Series are designed with digital power which provides accurate power control and excellent power efficiency
Polymer Aluminum Capacitor
The Ultra High Performance Conductive Polymer Aluminum Capacitor has a small PCB foot print but high volumetric capacitance that makes 20-phase power possible on the RX 7900 series graphics card. The capacitor offers stable capacitance at a high frequency and temperature with very low signal noise, ensuring the stability and reliability of the product.
TG Copper PCB
The GPU is mounted on to the high-density 14 layer 2oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation.
VRM Cooling
Dedicated VRM cooling module to create optimal heat dissipation for peak airflow and cooling performance.
Fan Blade
The Angular Velocity Fan Blade provides a double layer of downward air pressure which alongside the air pressure on the outer ring of the Axial fan, results in up to 44% more downward air pressure and up to 19% more airflow for a quieter and cooler operation when compared to the previous generations.
SPECIFICATIONS:
GPU: AMD Radeon™ RX 7900 XTX Graphics Card 5nm GPU; AMD RDNA™ 3 Architecture
Engine Clock: Boost Clock: Up to 2680 MHz; Game Clock: Up to 2510 MHz
Stream Processors: 6144
Compute Units: 96 CU (with RT+AI Accelerators)
Infinity Cache: 96MB
Ray Accelerators: 96
Memory Size/Bus: 24GB/384 bit GDDR6
Memory Clock: 20 Gbps Effective
Displays: Maximum 4 Displays
Resolution: HDMI™: 7680×4320
DisplayPort 2.1: 7680×4320
Interface: PCI-Express 4.0 x16
Output: 2x HDMI; 2x DisplayPort
BIOS Support: Dual UEFI
Game Index: 4K
Sapphire Features
- Dual BIOS
- TriXX Software Switch
- Premium Digital Power Design
- Ultra High Performance Conductive Polymer Aluminum Capacitors
- Fuse Protection
- Tri-X Cooling Technology
- Vapor-X Cooling
-High TG Copper PCB
- Optimized Composite Heatpipe
- Intelligent Fan Control
- Precision Fan Control
- Metal Backplate with ARGB
- Dual ARGB Light Bar
- Two-Ball Bearing Fans
- Angular Velocity Fan Blade
-Assistive System Fan Control
- Die Casted Aluminum-Magnesium Alloy Frame
- Frontplate Heatsink for VRM
-Wave Fin Design
- V Shape Fin Design for GPU Cooling
- TriXX Supported
- Fan Check
- Fan Quick Connect
- TriXX Boost
- NITRO Glow
- External RGB LED MB Synchronization
Accessories Bundled
- Graphics Card Supporter
- ARGB Extension Cable
AMD Features
- AMD RDNA™ 3 Architecture
- 96 AMD RDNA™ 3 Compute Units (with RT+AI Accelerators)
- 96MB AMD Infinity Cache™ Technology
- DisplayPort™ 2.1 Support
- AMD Radiance Display™ Engine
- 24GB GDDR6 on 384-Bit Memory Bus
- PCI® Express 4.0 ready
- AMD FidelityFX™ Super Resolution technology
- Microsoft® DirectX® 12 Ultimate Support
- Microsoft® DirectStorage Support
- Vulkan® Optimized
- AMD Smart Technologies
- AMD Software: Adrenalin Edition™
- AMD Noise Suppression
- AMD Privacy View
- AMD Radeon™ Super Resolution technology
- AMD Link
- AMD FreeSync™ Technology*
Cooling: 3 Fans; Vapor-X Cooling
Form Factor: 3.5 slot, ATX
Dimension: 320(L)X 135.75(W)X 71.6 (H)mm
Power Consumption: 420W Total Board Power
OS: Linux®, Windows® 10, and Windows 11. 64-bit operating system required
System Requirement
-Minimum 800 Watt Power Supply
-3 x 8-pin Power Connector.
-PCI Express® based PC is required with one X16 lane graphics slot available on the motherboard.
-Minimum 8GB of system memory. 16GB recommended.
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